Co-author at « POWER » on November 2019
The international workshop POWER covers the power management for transportation and industrial systems, the energy harvesting and conversion systems. In the scope of my research, Thomas DIAS presented his work on the manufacturing process optimization of copper nano wires.
Contributor at « ECPE » on September 2019
The presentation of Vincent Bley shows an academic approach to the interconnection of power switches for module 3.0 at the « Power Modules of the Future » workshop with a special focus on technology.
Research from Ampère, Laplace, SATIE and Mitsubishi Electric R&D Centre Europe laboratories.
Speaker at « MiNaPAD » on May 2019
MiNaPAD is a 2-day international conference and exhibition. The objective of this event is to strengthen the links between the electronics design and assembly community. The publication and the presentation at the conference focused on the three-dimensional integration of power semiconductor devices using PCB-embedding technology and nanometric structured interfaces as interconnects.
This publication was elected Best Paper Award of the 2019 session.
Speaker at the « GT PCB » of the GdR SEEDS on November 2018
The working groupe aims on the printed circuit board in the power electronics applications. It covers the issues of substrate functionalization, as well as its limits of use. My presentation was focused on a complete state of the art on the active components integration and thereafter the proposed alternative solution. You will find online the report of this meeting.
Interview with the « Technopolitain » on April 2018
Every month, the newspaper’s editorial staff dedicates an article to former students of the Grand Poitiers Technopole, whose professional careers stand out. This eighth episode is devoted to an interview about my academic and professional career.
By Marc-Antoine Lainé